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Responsible for developing, programming, optimizing, and sustaining SMT and through-hole manufacturing processes to ensure stable, high-quality, and cost-effective electronic assembly operations. Supports production readiness for new product introductions (NPI) and product transfers, ensuring process capability, tooling readiness, and manufacturing documentation are fully in place. Process Engineering Develop, document, and maintain SMT and through-hole assembly processes including screen printing, pick & place, reflow soldering, wave soldering, and manual insertion. Define process parameters and ensure optimal soldering profiles for product quality and throughput. Evaluate and select materials, tooling, and fixtures for new and existing products. Maintain process documentation including work instructions, setup sheets, and process control plans. Lead line setup and qualification activities for new products and transferred assemblies. In addition to those required by the department's needs and / or assigned by the Supervisor. Production Support Provide real-time technical support to resolve process and equipment issues impacting production. Analyze defects, perform root cause analysis, and implement corrective/preventive actions (CAPA). Collaborate with Maintenance and Equipment Technicians to ensure optimal line performance and uptime. Program and optimize SMT equipment, including screen printers, placement machines, and reflow ovens, ensuring accuracy, repeatability, and production efficiency. Define and validate process parameters for wave soldering and through-hole insertion, ensuring solder joint integrity and process stability. Continuous Improvement New Product Introduction & Transfers Experience Previous: Minimum 8 years in SMT and through-hole assembly process engineering. Experience setting up and optimizing SMT equipment (printers, pick & place, reflow ovens). Experience with wave soldering, selective soldering, and manual insertion processes. Background in Lean Manufacturing, process validation, and root cause analysis. English level: Advanced Competencies Technical problem-solving and analytical skills. Communicationandteamwork. Resultsorientation. Continuousimprovementmindset. Processdiscipline anddocumentationrigor. Knowledge required SMT andthrough-holeprocesstechnologies. Solderingmaterialsandequipmentsetup. StatisticalProcessControl (SPC) and DOEmethods. LeanManufacturingprinciples.Qualitysystems(IPC-A-610, J-STD-001, ISO 9001). #J-18808-Ljbffr
