Thermal-mechanical Engineer
hace 1 mes
We are seeking a dynamic individual to join the DCAI's Custom Design Engineering (CDE) team as a Sr. Mechanical/Thermal Engineer. This individual will be part of a larger a cross functional Architecture/Engineering team (i.e. Board/ System, Mechanical, Thermal, SI/PI/PD, etc.) responsible for Co-Engineering Custom Design Systems with strategic customers.
Additionally, this person will be a contributor in CDE's Thermal/Mechanical Center of Excellence (CoE) - defining/driving/bringing to market new platform level innovations and solutions that proactively addresses Thermal/Mechanical issues our CSPs face, integrate Intel's Adjacent Technologies/Solutions (i.e., Networking, MCR, AI/Machine Learning, etc.), and drive new mechanical and/or thermal innovations that push next level performance within the CSP's environment.
**Responsibilities will include but not be limited to**:
- Architect, model, and design mechanical solutions that meet both internal and external requirements at the data center, rack, system, board, and component level.
- Provide/deliver 3D CAD models for both system and board level floor-planning and to analyze engineering trade-offs with the rest of the cross functional team.
- Create new mechanical and/or thermal innovations that address our customer's top problem statements, and enable higher performance on Intel solutions (fail, learn, succeed).
- Work with internal stakeholders to be the CSP voice/feedback loop to the greater Intel (i.e., improve current and future TMDGs, educate CSP challenges and roadblocks, etc.).
- Analyze both mechanical and thermal test/validation data and correlate to modeling.
**Qualifications**:** Minimum Qualifications,** are required to be initially considered for this position:
**5+ years of experience in**:
- Mechanical engineering, 3D CAD modeling, heat transfer, thermal engineering, and test/validation techniques of said solutions.
- 3D CAD modeling tools (i.e., Solidworks, or Pro\Engineer-Creo).
- System or Platform design relating to passive and active (forced air and liquid) thermal solutions.
- Advanced English level.
The position is in Mexico, it is not eligible for employment-based visa/immigration sponsorship.
- Master of Science degree with 3+ years of industry experience, or PhD degree in Mechanical Engineering or related field.
- Manufacturing processes including Injection Molding, Extrusions, Sheet Metal and CNN would be an added advantage.
- Broad thermal engineering with exposure in thermal simulation tools Flotherm or IcePak.
**Inside this Business Group**:
The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.
**Posting Statement**:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
**Benefits**:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
**Working Model**:
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