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México General Electric A tiempo completo

**Responsibilities**- Knowledge in Electronic Computer Aided Design Software (ECAD) like Mentor Graphis, Cadence, Altium Designer etc.- Draw multilayer (8-24 layer) PCB.- Work closely with circuit design engineers to complete layout task withing defined cost and schedule.- Support generation of printed circuit board fabrication information guided by CIrcuid Card LayOut Lead engineer.- Support Engineering Change Requests (ECRs) on modification of existing circuit card fabrication information.- Application of IPC PCB Standards**Qualifications**:- Bachelor’s degree level in an electronic discipline, or equivalent experience.- Experience in engineering related activities focused in CAD for electronics.- Professional technical writing and technical communication proficiency.- Knowledge of board level digital design including schematic capture, implementation, integration, and verification.- Strong professional technical writing proficiency and technical communication.**Desired Qualifications**:- Knowledge in High Density Interconnect (HDI) technologies (micro vias, buried / blind vias, back drilling) for IPC Class 3 board.- Knowledge in routing of 5+ Gbps serial links. (10GBASE-KR, PCIe Gen3, Fiber Optics)- Knowledge in board simulations including Power Integrity (PI) and Signal Integrity (SI).- Knowledge in routing Gigahertz microprocessors, FPGA, CPLD, DDR3 or DDR4 memory, flash memory, Gigabit Ethernet, and PCIe.- Knowledge in routing large pin count devices, 1000+ pins with 0.8mm device pitch or smaller.- Knowledge in routing with CAN & diverse communications protocols.- Familiarity with Microsoft Office, Microsoft Visio.**Additional Information**:**Relocation Assistance Provided**:No


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