Ic Failure Analysis Engineer

hace 6 días

Las Villas Santa Fe, México NAPS Mexico A tiempo completo

The primary responsibility of this position is to perform analysis of products to determine the root cause of failures. This effort will consist of using a variety of mechanical, chemical, and electrical analysis techniques to support failures of customer returns, yield-related issues, and reliability-related concerns.**Responsibilities**:- Perform failure analyses on complicated issues requiring creative problem-solving and patience.- Conduct physical failure analysis by examining individual layers of silicon to reveal evidence of defects.- Perform advanced electrical fault isolation analysis using techniques like XIVA, OBIRCh, Photo Emission Microscopy, and Lock In Thermal microscopy to localize areas of interest and isolate defect locations.- Administer non-destructive testing on devices using imaging tools (e.g., X-ray, C-SAM) and/or optical inspections.- Contribute to writing papers and publications documenting failure analysis approaches.- Document results of failure analysis, report identified root causes, and deliver conclusions to requesters.- Determine the type of failure analysis needed to identify reported issues and conduct appropriate analysis with mínimal guidance.- Act as the case owner for complicated defects, handling all relevant issues.- Participate in process improvements to gain efficiencies or development initiatives and identify innovative methods for identifying and/or preventing defects.- Coordinate with partners in other teams (e.g., design team, product team) to share device issues and work toward solutions.**Qualifications**:- Bachelor's degree in Electrical Engineering, Microelectronics, Physics, or equivalent.- 2+ years of chip-level Failure Analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing) experience or related work experience.- 2+ years working in a physical/chemical laboratory setting.- Proficiency in various physical and electrical analysis techniques such as mechanical polishing, chemical delayering, SEM inspection, curve trace, thermal emission, photon emission, and OBIRCH/TIVA.- Strong knowledge of semiconductor physics, semiconductor devices, circuitry analysis, and wafer fabrication processes.- Experience in SEM-based nano-probing with EBIC, EBAC, and EBIRCH on planar, SOI, and FinFET technologies.- Familiarity with SCAN logic, Memory BIST, and RF/Analog design strategies.- Familiarity with reliability testing for device and packaging product qualification, including CDM, HBM, TLP, HTOL, BHAST, and BURN-IN.- Excellent communication, organization, and project management skills.- Ability to work in a laboratory environment and collaborate effectively with multi-functional teams.- Quick learner and able to perform independent work.- Flexible working hours, including weekend or midnight shifts.Ability to commute/relocate:- 22666, Las Villas Santa Fe, B.C.: Reliably commute or willing to relocate with an employer-provided relocation package (required)**Language**:- English (required)License/Certification:- Visa (preferred)Work Location: In person

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