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OverviewWe are a leading company in the wireless broadband communications industry looking for talented professionals with a winning attitude.ResponsibilitiesDevelop packaging processes according to demand, workstations, equipment, and required toolingDefine and maintain takt time for each process and ensure proper line balancing related to packaging operationsDesign primary, secondary, and tertiary packaging and prepare technical specificationsParticipate in the launch of new processes and production-driven improvementsParticipate in and sustain the use of DFX during the NPI process to ensure successful, failure-free product introductionsProvide rapid response to process issues; follow up on root cause analysis and QRQCPlan and execute drop, vibration, and compression testing, and release designs in coordination with the TW groupDocument BOMs, drawings, packaging instructions, and change control in PLM/ERP systemsOptimize cost, palletization, and logistics footprint; drive sustainability initiatives (material reduction, recyclability)Manage suppliers and coordinate line, quality, and logistics trialsUnderstand and participate in the preparation of Control PlansFollow up on, respond to, and close corrective actions and observations generated from process and product audits, as well as customer complaintsProvide feedback to the design team to improve manufacturability of new productsDesign and perform tests to evaluate product integrity, using statistical tools for process monitoring and validation such as capability analysis (Cp, Cpk), control charts, Pareto analysis, Gage R&R studies, etc.Actively participate in pilot runs for new model introductions and/or validation of new components or processesEducation, Knowledge, And ExperienceBachelor’s degree in Industrial, Electronic, Electromechanical, Manufacturing Engineering, or a related fieldAdvanced proficiency in English (mandatory)3 to 5 years of experience in a similar role within the electronics industry (preferred)Knowledge of materials and processes: corrugated, plastics, foams, wood; injection molding, thermoforming, die-cuttingStrong knowledge of statistical tools and methodologies: DOE, FMEA, Cp, Cpk, SPC, APQPExperience managing engineering documentation: ECNs, Process DeviationsAdvanced proficiency in SolidWorks and/or AutoCAD (mandatory)Knowledge of relevant standards and regulations such as ISTA and ASTM; certification preferredEducationRefer to the Bachelor’s degree requirements above for educational qualifications.Work Experience3 to 5 years of experience in a similar role within the electronics industry (preferred)LanguageAdvanced proficiency in English (mandatory)SkillsAdvanced Product Quality Planning (APQP), Design Assurance, Design Consideration, Economic Production, Eight Disciplines Problem Solving (8D), Employee Retention, Engineering Management, Evaluating Staff, Failure Mode Effects And Criticality Analysis (FMECA), Failure Reporting Analysis And Corrective Action Systems, Job Descriptions, Package Testing, Process Layout, Production Improvement, Talent Management, Workforce Development #J-18808-Ljbffr
