Senior Advanced Packaging Technology Development Engineer
hace 4 semanas
We are seeking an experienced Senior Advanced Packaging Technology Development Engineer to join our Process Development team. As a key member of this team, you will be responsible for developing and optimizing Package Assembly processes for Micron's memory products.
About the RoleThis is a critical position that requires a strong understanding of semiconductor manufacturing processes, particularly in front-end, bonding, and back-end packaging. You will work closely with cross-functional teams to develop, configure, and optimize package assembly processes from pathfinding through NPI start-up.
Responsibilities- Develop and optimize Package Assembly processes for Micron's memory products.
- Collaborate with Design teams globally to develop and maintain design rules for package assembly.
- Assess and interpret process data to optimize system performance.
- Work closely with Manufacturing teams to ensure seamless integration of new processes.
- Participate in design approvals for substrates and silicon.
To succeed in this role, you must have:
- More than 7 years of experience in semiconductor manufacturing or a related field.
- Hands-on experience in Semiconductor Packaging or Fab Frontend processes.
- Strong analytical and problem-solving skills.
- Effective communication and collaboration skills.
- Familiarity with HBM (High Bandwidth Memory) or Advanced Packaging integration is a plus.
Micron offers a competitive salary range: $145,000 - $200,000 per year, depending on location and experience. Additionally, you can expect a comprehensive benefits package, including medical, dental, and vision coverage, as well as a 401(k) plan with company match.
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