Senior Advanced Packaging Technology Development Engineer

hace 4 semanas


Tlaquepaque, Jalisco, México Micron A tiempo completo
Job Description

We are seeking an experienced Senior Advanced Packaging Technology Development Engineer to join our Process Development team. As a key member of this team, you will be responsible for developing and optimizing Package Assembly processes for Micron's memory products.

About the Role

This is a critical position that requires a strong understanding of semiconductor manufacturing processes, particularly in front-end, bonding, and back-end packaging. You will work closely with cross-functional teams to develop, configure, and optimize package assembly processes from pathfinding through NPI start-up.

Responsibilities
  • Develop and optimize Package Assembly processes for Micron's memory products.
  • Collaborate with Design teams globally to develop and maintain design rules for package assembly.
  • Assess and interpret process data to optimize system performance.
  • Work closely with Manufacturing teams to ensure seamless integration of new processes.
  • Participate in design approvals for substrates and silicon.
Requirements

To succeed in this role, you must have:

  • More than 7 years of experience in semiconductor manufacturing or a related field.
  • Hands-on experience in Semiconductor Packaging or Fab Frontend processes.
  • Strong analytical and problem-solving skills.
  • Effective communication and collaboration skills.
  • Familiarity with HBM (High Bandwidth Memory) or Advanced Packaging integration is a plus.
Benefits

Micron offers a competitive salary range: $145,000 - $200,000 per year, depending on location and experience. Additionally, you can expect a comprehensive benefits package, including medical, dental, and vision coverage, as well as a 401(k) plan with company match.



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