Lead Digital Circuit Designer

In this dynamic role, you will collaborate with lead design engineers on board-level circuit design, integration, verification, and documentation of state-of-the-art aerospace processors and FPGA assemblies. This position combines some leadership with hands-on technical work, requiring you to contribute at every stage of the design cycle.**Roles and Responsibilities**- Design complex avionics systems, integrating both digital and analog components.- Stay aware of technology trends and advancements in embedded systems and electronic components.- Design processor and FPGA assemblies, including schematic capture, component placement, layout constraints, PWB stack-up, and layout review/approval.- Conduct board bring-up, integration, and verification activities to ensure robust performance.- Troubleshoot mid-high complex issues involving processors, FPGAs, and memory components.- Participate in architectural trade studies and proposal development to drive strategic decisions.- Interface with customers independently, providing expert guidance and support.- Mentor junior engineers, fostering their growth and development.- Lead and coordinate multi-disciplinary design teams, ensuring cohesive and effective collaboration.- Propose and implement improvements in internal processes to drive efficiency and innovation.**Required Qualifications**- Bachelor’s degree in Electrical Engineering or related field.- Proven experience in board-level digital design, including schematic design, implementation, integration, and verification.- Expertise in designing high-speed interfaces.- Understanding in Board Level Timing Analysis, Stress and Derate Analysis, Signal Integrity & Power Integrity.- Great technical writing and communication skills.- Experience mentoring and sharing expertise with junior engineers.**Desired Characteristics**- Master’s degree in Electrical Engineering with 6+ years of professional experience in digital design.- Proven track record of designing complex digital hardware systems.- In-depth knowledge of the board-level digital design process, from schematic capture to implementation, integration, and verification.- Expertise in laying out complex Printed Wiring Boards (PWBs).- Experience designing with high-speed components such as Gigahertz microprocessors, FPGA, CPLD, DDR3 or DDR4 memory, flash memory, Gigabit Ethernet, and PCIe.- Proficiency in working with large pin count devices, featuring 1000+ pins with 0.8mm device pitch or smaller.- Skilled in High Density Interconnect (HDI) technologies, including micro vias, buried/blind vias, and back drilling for IPC Class 3 boards.- Experience in designing high-speed serial links of 5+ Gbps, such as 10GBASE-KR, PCIe Gen3, and Fiber Optics.- Familiarity with communication protocols like CAN, MIL-STD-1553, ARINC 429, ARINC 664, and TSN.- Knowledge of OpenVPX and PICMG standards.- Extensive experience in the Military, Aerospace, or Avionics sectors.- Proficient with Mentor Graphics Expedition Enterprise and HyperLynx PI/SI tools.- Familiarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, and Microsoft Visio.- Strong technical writing and communication skills.Note:**To comply with US immigration and other legal requirements, it is necessary to specify the minimum number of years’ experience required for any role based within the USA.** **For roles outside of the USA, to ensure compliance with applicable legislation, the JDs should focus on the substantive level of experience required for the role and a minimum number of years should NOT be used.****Additional Information**:**Relocation Assistance Provided**:No