10 - Manager, Manufacturing Process Engineering 2

Req ID: 128820
Remote Position: No
Region: Americas
Country: Mexico
State/Province: Nuevo Leon
City: Monterrey

**General Overview**:
**Job Title**: Manager, Manufacturing Process Engineering 2
**Functional Area**: Engineering (ENG)
**Career Stream**:Process Engineering Manufacturing (PRM)
**Role**:Manager (MG2)
**Job Code**:MG2-ENG-PRM
**Job Band**:10
**Direct/Indirect Indicator**:Indirect

**Summary**:
The Manager, Manufacturing Process Engineering is responsible for leading and managing the work of designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.

**Detailed Description**:
Performs tasks such as, but not limited to, the following:

- Responsible for understanding the customers technical roadmap and identifying and managing all new customer-specific process development projects.
- Manage technical aspects for all new customer-specific process development projects.
- Develop the scope of all technical work, coordinate the team, direct work assignments and assist with problem resolution for the full customer product life cycle support for all manufacturing technical issues related to the customers product(s) from product conception to product obsolescence.
- Evaluate potential manufacturing impact for each design concept.
- Set yearly plans and goals for their department and give direction on expected performance and provide regular performance evaluations and ongoing feedback. Accountable for all department objectives and achieving agreed targets for key performance indicators.

**Knowledge/Skills/Competencies**:
Technical Skills
- NPI-PCBA: ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Engineering Control & System Tools (ODC/SCE), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes, structural test and inspection processes, machining, welding, CNC programming, secondary processes, sheet metal, DFAA.
- DFX: ESD Controls, Component Prep, Component Module Programming, Laser Marking, Screening, Stencil Design, Solder Paste Dispense / Jetting, SMT Programming, SMT Placement, SMT Reflow, Sweat Soldering, Flex Board Assembly / Handling, Pallet Design, PTH Soldering, Robot Soldering, PTH manual Assembly, PTH Auto Assembly, Pressfit, Depanelization, Mechanical Assemb;y (TIMs, Heatsinks, PCBA, Hotbar, Ultrasonic Welding), Wire Harness Assembly, Wire Prep, System Assembly, SMT and PTH Rework, Cleaning Processes, Conformal Coating, Underfills / Edgebonding / Potting, Pack and Ship, Chassis Assembly (fluidics, electrical enclosure, cable routing), Sheet Metal, Machining, Welding, Structural Test (API, AOI, AXI, ICT, Flying Probe)
- MECHANICAL & SYSTEMS ASSEMBLY : ESD Controls, Wire Harness Assembly, Auto Wire Prep, Mechanical Assembly - System Build, OEE / Industrial Engineering, Pack & Ship, Vacuum System, Fluidics, Electrical Enclosure, Cable Routing, Electrical - Automation, Mechanical - Automation, Machine Vision, IPC-610, Engineering Controls, Quality Data (KPI), Manufacturing Operational Management, DFM - Manufacturing, DFA - Assembly, DFAA - Automated Assembly, DFT - Physical Test
- PCBA ASSEMBLY : ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes.

**Physical Demands**:

- Duties of this position are performed in a normal office environment.
- Duties may require extended periods of sitting and sustained visual concentration on a computer monitor or on numbers and other detailed data.
- Repetitive manual movements (e.g., data entry, using a computer mouse, using a calculator, etc.) are frequently required.
- Occasional travel may be required.

**Typical Experience**:

- 7 to 10 years of related experience;Experience in similar job roles

**Typical Education**:
Bachelor degree or consideration of an equivalent combination of education and experience.

Educational Requirements may vary by Geography

**Notes**:
Celestica